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AuSn Pre-Deposited AlN Ceramic Submounts
High-performance packaging substrate material with micron-scale gold-tin (AuSn) solder layers pre-deposited onto metallized aluminum nitride (AlN) ceramic plates. With excellent thermal management features and highly reliable die-attach performance, they are widely used in applications such as high-power diode lasers and optical communication modules, enabling higher device stability, longer system lifetime, and more scalable process.
With its outstanding advantages, the AlN-based submounts are becoming a key enabling technology for next-generation high-performance optical communication modules, when the demands on thermal performance and reliability in optical communications and advanced packaging continue to grow.
AuSn Pre-Deposited CuW Submounts
As the submount for the heat dissipation of high-power diode laser bar chips, the AuSn pre-deposited CuW material is fabricated through pre-deposition of micron-level AuSn thin film in specific areas of copper-tungsten submounts. It is a key technology that ensures the long-term reliable use of optoelectronic devices.
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